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    Silver Alloy Bonding Wire

    ? Low resistivity
    ? Cost effective
    ? High reliability and bondability
    ? Long shelf time
    ? High reflectivity in short wave length range
    ? Softer FAB

    Classification

    Classification Characteristics Areas of application
    WS-SAG9 Good Reflecton,Soft

    QFP、BGA、Discrete、SOP、QFN、TSOP、SOT, LED PACKAGE

    WS-HGS8 High performance
    WS-SAG5 Low resistivity
    WS-SAG2 Softer FAB

    Mechanical Properties

    Dia EL(%) BL(gf)
    mil um WS-SAG9 WS-HGS8 WS-SAG5 WS-SAG2 WS-SAG9 WS-HGS8 WS-SAG5 WS-SAG2
    0.6 15 5-10 2-9 5-10 5-10 >3.0 >4.0 >3.5 >4.0
    0.7 18 7-13 2-9 7-13 7-13 >4.0 >4.0 >4.0 >5.0
    0.8 20 7-13 2-9 7-13 7-13 >6.0 >6.0 >6.0 >6.0
    0.9 23 7-13 2-9 7-13 7-13 >8.0 >8.0 >8.0 >8.0
    1.0 25 7-13 2-9 7-13 7-13 >10.0 >10.0 >10.0 >10.0
    1.2 30 8-15 3-12 8-15 8-15 >14.0 >13.0 >13.0 >15.0

    TDS for Au Wire

    Main Purity

    Ag 99%

    Ag97%

    Ag95%

    Ag92%

    Ag88%

    Wire Type

    SAG9

    SAG7

    SAG5

    SAG2

    HGS8

    Hardness(Hv)

    FAB

    35 ~ 45

    40 ~ 50

    45 ~ 55

    45-55

    45 ~ 55


    Wire

    45 ~ 55

    50 ~ 60

    55 ~ 65

    55-68

    60 ~ 70

    Fusing Current(A)(±0.02A,Length=10mm)

    0.29 ~ 1.20

     0.30 ~ 1.25

    0.31 ~ 1.34

    0.31-1.31

    0.31 ~ 1.32

    Resistivity(u? Cm)

    2.2 

    3.1 

    3.2

    3.9

    4.6

    Recrystalization Temp.(℃)

    410~480

    410~480

    410~480

    410~480

    410~480

    Elastic Modulus(Gpa)

    75 ~ 90

    75 ~ 90

    75 ~ 90

    75 ~ 90

    75 ~ 90

    Melting Point(℃)

    980 ~ 1010

    980 ~ 1010

    980 ~ 1010

    980 ~ 1010

    980 ~ 1010

    Density(gr/?)

    10.31

    10.61

    10.63

    10.68

    10.94

    Cofficient of Linear thermal Expansion(20~100℃)

    18~20 x 10-6

    18~20 x 10-6

    18~20 x 10-6

    18~20 x 10-6

    18~20 x 10-6

    Shelf Life(From data of Manufacturing/day)

    12Months

    12Months

    12Months

    12Months

    12Months

    Floor Life(Opened from barrier bag)

    2Weeks

    2Weeks

    2Weeks

    12Months

    2Weeks

    Product application

    FBump Ball Application
    Ag Alloy Wire
    Address:NO.66,Jinfu Road,Baoshan District,Shanghai   Email:ls@shwonsung.com   hch@shwonsung.com    cz@shwonsung.com
    Contact:Jack Liu 13801702414 / Jimmy Hu 13916223063 / Jason Chen18317138794
    Phone:021-51281028-821 Fax:021-51281028
    About us Product Research And Develop Contact Us Copyright(C) 2017 SHANGHAI WONSUNG ALLOY MATERIALS CO.,LTD. All Rights Reserved 滬ICP備18010709號-1
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