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    Gold Bonding Wire

    Merit:
    ? Au bonding wire for stable stitch bond
    ? Supper low loop Au bonding wire
    ? High strength Au bonding wire
    ? Au bonding wire for fine pitch bonding

    Classification

    Classification Characteristics Areas of application
    WS-G01 Good 2nd bond stitch remaining after pull test QFN、QFP、BGA package
    WS-G02 High strength,good loop stability, good bump formation for a stack die package, applicable for multiple loop profiles in BGA Long/short loop、Stacked package、Flat integrated circuits
    WS-G03 Lower loop height,less damage at neck region,good high temperature strength Low loop , Flat integrated circuits COB, foil frames
    WS-G04 Small deformation of squashed ball by ultrasonic frequency Applicable for narrow pad pitch bonding

    Mechanical Properties

    Classification Characteristics Areas of application
    mil um WS-AU01 WS-AU02 WS-AU03 WS-AU04 WS-AU01 WS-AU02 WS-AU03 WS-AU04
    0.6 15 2-5 2-5 2-5 2-5 >2.5 >3.0 >3.5 >4.0
    0.7 18 2-5 2-5 2-5 2-5 >2.5 >3.5 >4.0 >5.0
    0.8 20 2-6 2-6 2-6 2-6 >4.0 >4.5 >6.0 >6.0
    0.9 23 2-7 2-7 2-7 2-7 >5.0 >6.0 >8.0 >8.0
    1.0 25 2-8 2-8 2-8 2-8 >7.0 >8.0 >10.0 >10.0
    1.2 30 3-8 3-8 3-8 3-8 >11.0 >12.0 >13.0 >15.0
    1.3 33 3-9 3-9 3-9 3-9 >13.0 >14.0 >16.0 >18.0
    1.5 38 3-10 3-10 3-10 3-10 >17.0 >18.0 >21.0 >22.0
    1.7 43 3-11 3-11 3-11 3-11 >22.0 >24.0 >26.0 >28.0
    2.0 50 3-12 3-12 3-12 3-12 >30.0 >32.0 >34.0 >36.0

    TDS for Au Wire

    Main Purity 4N Au 2N Au
    Wire Type WS-G01,02,03 WS-G04
    Hardness(Hv) FAB 42 ~47 40 ~ 50
    Wire 47 ~52 50 ~ 60
    Fusing Current(A)(±0.02A,Length=10mm) 0.28 ~ 1.37 0.28 ~ 1.35
    Resistivity(u? Cm) 2.3 2.9
    Recrystalization Temp.(℃) 500 ~ 550 500 ~ 550
    Elastic Modulus(Gpa) 70 ~ 80 70 ~80
    Melting Point(℃) 1050 ~1080 1050 ~1080
    Density(gr/cm2) 19.32 19.2
    Cofficient of Linear thermal Expansion(20~100℃) 13 ~ 15 x 10-6 13 ~ 15 x 10-6
    Shelf Life(From data of Manufacturing/day) 2 Years 2 Years
    Floor Life(Opened from PET PACK) 4Weeks 4Weeks

    Product application

    BGA Package Application Short Loop Application
    G02
    Wire Diameter:20um
    Loop Length:1.0&4.0mm
    G03
    Wire Diameter:20um
    Loop Length:0.8mm
    Fine pitch Application Small pitch bonding G04 Wire Diameter:20um
    Die to die IC-card module with chip and bonding wire
    connection
    BGA assembling
    Address:NO.66,Jinfu Road,Baoshan District,Shanghai   Email:ls@shwonsung.com   hch@shwonsung.com    cz@shwonsung.com
    Contact:Jack Liu 13801702414 / Jimmy Hu 13916223063 / Jason Chen18317138794
    Phone:021-51281028-821 Fax:021-51281028
    About us Product Research And Develop Contact Us Copyright(C) 2017 SHANGHAI WONSUNG ALLOY MATERIALS CO.,LTD. All Rights Reserved 滬ICP備18010709號-1
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